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DRAFT

Hp invents.

 

OPPORTUNITY at HP in San Diego.

 

We make ideas happen. And we make great products. Our locations are state-of-the-art, cutting edge, and all over the world. At hp, we don’t just dream about the future. We invent it.

 

Job description

 

Hardware engineer involved in the development state-of the-art thermal inkjet systems and instrumentation systems necessary to characterize new commercial printing products.

 

This position offers an exciting opportunity for a mechanical or electrical engineer to gain a wealth of cross functional experience in both R&D and manufacturing for an inkjet printing system, including: silicon die design and thermal inkjet fluidic architecture design and development. The focus of this position will be Mechanical Engineering support to develop and commercialize new inkjet technology.

 

This position will be staffed in R&D through the investigation and lab phases and may then transition to manufacturing.  In R&D the primary focus will be to identify key challenge areas, develop metrics, set goals, and drive resolution of thermal, energy, and fluidic issues.

 

To succeed in this position, one must be able to function in an environment where distributed ownership of issues and objectives is a reality. The key focus is to identify critical issues and work to ensure appropriate ownership and resolution, often pursuing detailed technical tasks in depth. Typical examples of such issues are:

 

· Translating challenge areas into metrics and specifications

· Developing designs and test plans to assess performance

· Ensuring test tool capability and supporting infrastructure

· Maturing documentation into parameter summaries for transfer to manufacturing

· Ensuring a high level of quality and reliability robustness

 

As such, a key aspect of the position is to function as a liaison to various organizations. Examples of key partner organizations are:

 

· Writing System

· Wafer fabrication

· Product design

· Product engineering

· Manufacturing development

· ASIC design

· Mask design

· Tooling and testbed development

 

A broad range of technical expertise is required to handle a complex range of issues with the appropriate delivery of quality results on schedule. Additionally, good organization, problem solving, documentation, and communication skills are essential.

 

Qualifications

 

Bachelor's (undergraduate), Master's (graduate) or Ph.D (post-graduate) degree in Mechanical Engineering or related discipline. Strong background and fundamental understanding of thermodynamics, fluid mechanics and thermal sciences. Understanding the limitations of modeling and interpreting the numerical simulation results as applied to complex transient thermal and fluid flow situations. Understanding of basic electrical engineering and its relationships to thermal effects and energy delivery.   Specialty in micro-scale fluidics and heat transfer is preferred.  Knowledge of Inkjet, MEMS design and fabrication, circuit analysis, writing system, wafer fab, design of experiments, statistics, reliability assessment and numerical modeling techniques are highly desirable

 

 

It is strongly desired that the candidate have a specialty in IJ (InkJet) thermal and fluidics architecture, IJ silicon design, test tool design specification, quality and reliability statistics, CFD modeling, thermal control, energy control, and other IJ-specific challenges including wafer-level design rules and knowledge of unit process constraints. Also, candidate must posses strong, proven leadership skills and a broad scope of experience spanning wafer fabrication to inkjet printer development.

 

Contact "Akhavin, Mohammad" mohammad.akhavain@hp.com